? semiconductor components industries, llc, 2006 may, 2006 ? rev. 6 1 publication order number: nl27wz00/d nl27wz00 dual 2?input nand gate the nl27wz00 is a high performance dual 2?input nand gate operating from a 1.65 v to 5.5 v supply. features ? extremely high speed: t pd 2.4 ns (typical) at v cc = 5.0 v ? designed for 1.65 v to 5.5 v v cc operation ? over voltage tolerant inputs ? lvttl compatible ? interface capability with 5.0 v ttl logic with v cc = 3.0 v ? lvcmos compatible ? 24 ma balanced output sink and source capability ? near zero static supply current substantially reduces system power requirements ? replacement for nc7wz00 ? chip complexity: fet = 112 ? pb?free package is available a1 1 figure 1. pinout v cc b1 gnd 2 3 8 7 6 4 5 y2 y1 b2 a2 a2 y2 figure 2. logic symbol & y1 a1 b2 b1 ieee/iec marking diagram us8 us suffix case 493 8 1 http://onsemi.com l1 = specific device code m = date code* = pb?free package 1 8 l1 m (note: microdot may be in either location) pin assignment pin 1 2 3 4 5 6 7 8 function a1 b1 y2 gnd a2 b2 y1 v cc inputs function table b l h l h output y h l a l l h h h h y = ab h = high logic level l = low logic level *date code orientation may vary depending upon manufacturing location. see detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ordering information
nl27wz00 http://onsemi.com 2 maximum ratings parameter symbol value unit dc supply voltage v cc 0.5 to 7.0 v dc input voltage v i 0.5 to 7.0 v dc output voltage v o 0.5 to 7.0 v dc input diode current v i < gnd i ik 50 ma dc output diode current v o < gnd i ok 50 ma dc output sink current i o 50 ma dc supply current per supply pin i cc 100 ma dc ground current per ground pin i gnd 100 ma storage temperature range t stg 65 to 150 c lead temperature, 1 mm from case for 10 seconds t l 260 c junction temperature under bias t j 150 c thermal resistance (note 1) ja 250 c/w power dissipation in still air at 85 c p d 250 mw moisture sensitivity msl level 1 flammability rating oxygen index: 28 to 34 f r ul 94 v?0 @ 0.125 in esd withstand voltage human body model (note 2) machine model (note 3) charged device model (note 4) v esd > 2000 > 200 n/a v latchup performance above v cc and below gnd at 85 c (note 5) i latchup 500 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. measured with minimum pad spacing on an fr4 board, using 10 mm?by?1 inch, 2?ounce copper trace with no air flow. 2. tested to eia/jesd22?a114?a. 3. tested to eia/jesd22?a115?a. 4. tested to jesd22?c101?a. 5. tested to eia/jesd78. recommended operating conditions parameter symbol min max unit supply voltage operating data retention only v cc 1.65 1.5 5.5 5.5 v input voltage (note 6) v i 0 5.5 v output voltage (high or low state) v o 0 v cc v operating free?air temperature t a 40 85 c input transition rise or fall rate v cc = 2.5 v 0.2 v v cc = 3.0 v 0.3 v v cc = 5.0 v 0.5 v t/ v 0 0 0 20 10 5 ns/v 6. unused inputs may not be left open. all inputs must be tied to a high? or low?logic input voltage level.
nl27wz00 http://onsemi.com 3 dc electrical characteristics parameter condition symbo l v cc (v) t a = 25 c 40 c t a 85 c uni t min typ max min max high?level input voltage v ih 1.65 2.3 to 5.5 0.75 v cc 0.7 v cc 0.75 v cc 0.7 v cc v low?level input voltage v il 1.65 2.3 to 5.5 0.25 v cc 0.3 v cc 0.25 0.3 v cc v high?level output voltage v in = v il or v ih i oh = ?100 a i oh = ?4 ma i oh = ?8 ma i oh = ?12 ma i oh = ?16 ma i oh = ?24 ma i oh = ?32 ma v oh 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 v cc ? 0.1 1.29 1.9 2.2 2.4 2.3 3.8 v cc 1.5 2.1 2.4 2.7 2.5 4.0 v cc ? 0.1 1.29 1.9 2.2 2.4 2.3 3.8 v low?level output voltage v in = v ih or v oh i ol = 100 a i ol = 4 ma i ol = 8 ma i ol = 12 ma i ol = 16 ma i ol = 24 ma i ol = 32 ma v ol 1.65 to 5.5 1.65 2.3 2.7 3.0 3.0 4.5 0.0 0.08 0.20 0.22 0.28 0.38 0.42 0.1 0.24 0.3 0.4 0.4 0.55 0.55 0.1 0.24 0.3 0.4 0.4 0.55 0.55 v input leakage current v in = v cc or gnd i in 0 to 5.5 0.1 1.0 a quiescent supply current v in = v cc or gnd i cc 5.5 1.0 10 a ac electrical characteristics t r = t f = 3.0 ns parameter condition symbo l v cc (v) t a = 25 c 40 c t a 85 c uni t min typ max min max propagation delay (figure 3 and 4) r l = 1 m c l = 15 pf t plh t phl 1.8 0.15 2.0 5.7 10.5 2.0 11.0 ns 2.5 0.2 1.2 3.2 5.3 1.2 5.7 r l = 1 m c l = 15 pf 3.3 0.3 0.8 2.4 3.7 0.8 4.0 r l = 500 c l = 50 pf 1.2 3.0 4.6 1.2 4.9 r l = 1 m c l = 15 pf 5.0 0.5 0.5 1.9 2.9 0.5 3.2 r l = 500 c l = 50 pf 0.8 2.4 3.6 0.8 3.9 capacitive characteristics parameter condition symbol typical unit input capacitance v cc = 5.5 v, v i = 0 v or v cc c in 2.5 pf power dissipation capacitance (note 7) 10 mhz, v cc = 3.3 v, v i = 0 v or v cc 10 mhz, v cc = 5.5 v, v i = 0 v or v cc c pd 9 11 pf 7. c pd is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption with out load. average operating current can be obtained by the equation: i cc(opr ) = c pd v cc f in + i cc . c pd is used to determine the no?load dynamic power consumption; p d = c pd v cc 2 f in + i cc v cc .
nl27wz00 http://onsemi.com 4 figure 3. switching waveform input c l * *c l includes all probe and jig capacitances. a 1?mhz square input wave is recommended for propagation delay tests. figure 4. test circuit t f = 3 ns v cc gnd v oh v ol 90% 50% 10% 50% t plh t phl output y input a and b t f = 3 ns 90% 50% 10% 50% output v cc tape trailer (connected to reel hub) no components 160 mm min tape leader no components 400 mm min components direction of feed cavity tape top tape figure 5. tape ends for finished goods figure 6. us8 reel configuration/orientation 1 8.00 + 0.30 ? 0.10 4.00 2.00 1.75 3.50 0.25 1.00 0.25 typ 4.00 direction of feed tape dimensions mm 1.50 typ
nl27wz00 http://onsemi.com 5 figure 7. reel dimensions 13.0 mm 0.2 mm (0.512 in 0.008 in) 1.5 mm min (0.06 in) 50 mm min (1.969 in) 20.2 mm min (0.795 in) full radius t max g a reel dimensions tape size 8 mm t and r suffix us a max 178 mm (7 in) g 8.4 mm, + 1.5 mm, ?0.0 (0.33 in + 0.059 in, ?0.00) t max 14.4 mm (0.56 in) figure 8. reel winding direction direction of feed barcode label hole pocket ordering information device device nomenclature package shipping ? logic circuit indicator no. of gates per package temp range identifier technology device function package suffix nl27wz00us nl 2 7 wz 00 us us8 3000/tape & reel nl27wz00usg ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nl27wz00 http://onsemi.com 6 package dimensions us8 case 493?02 issue b dim a min max min max inches 1.90 2.10 0.075 0.083 millimeters b 2.20 2.40 0.087 0.094 c 0.60 0.90 0.024 0.035 d 0.17 0.25 0.007 0.010 f 0.20 0.35 0.008 0.014 g 0.50 bsc 0.020 bsc h 0.40 ref 0.016 ref j 0.10 0.18 0.004 0.007 k 0.00 0.10 0.000 0.004 l 3.00 3.20 0.118 0.126 m 0 6 0 6 n 5 10 5 10 p 0.23 0.34 0.010 0.013 r 0.23 0.33 0.009 0.013 s 0.37 0.47 0.015 0.019 u 0.60 0.80 0.024 0.031 v 0.12 bsc 0.005 bsc notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters. 3. dimension ?a? does not include mold flash, protrusion or gate burr. mold flash. protrusion and gate burr shall not exceed 0.140 mm (0.0055?) per side. 4. dimension ?b? does not include inter?lead flash or protrusion. inter?lead flash and protrusion shall not e3xceed 0.140 (0.0055?) per side. 5. lead finish is solder plating with thickness of 0.0076?0.0203 mm. (300?800 ?). 6. all tolerance unless otherwise specified 0.0508 (0.0002 ?). l b a p g 4 1 5 8 c k d seating j s r u detail e v f h n r 0.10 typ m ?y? ?x? ?t? detail e t m 0.10 (0.004) xy t 0.10 (0.004) plane *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* mm inches scale 8:1 3.8 0.15 0.50 0.0197 1.0 0.0394 0.30 0.012 1.8 0.07 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, r epresentation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5773?3850 nl27wz00/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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